About Advanced Substrate Technologies Pte. Ltd.

We are a Singapore-based subsidiary of TOPPAN Holdings Inc., a Japanese pioneer in printing technologies and a leading supplier of high-quality Flip Chip Ball Grid Array (FC-BGA) substrates. We are the first factory in Singapore to pioneer the manufacturing of high-end FC-BGA substrates used in cutting-edge semiconductor products such as network switches and artificial intelligence (AI)/machine learning (ML) devices.

Additionally, our facility will conduct research and development (R&D) aimed at advancing substrate technologies to meet the evolving performance requirements of future products in these domains. Broadcom Inc., a global technology leader specializing in semiconductor design, enterprise software, and security solutions, is also actively supporting the establishment of this state-of-the-art manufacturing facility in Singapore.

 

Our Research & Development

Do you thrive on developing groundbreaking technologies that lead to amazing new products? Are you meticulous and committed to excellence, always aiming for extraordinary results? Come see what you can achieve with AST R&D team! We believe that new ideas swiftly become remarkable products. With your passion and dedication, there’s no telling the impact you’ll make.

 

Company Overview

Our AST R&D team is on a mission to transform AI and develop groundbreaking hardware. We’re creating innovative solutions for tighter, quicker, and more dependable integration of processing and memory, moving beyond the limitations of current substrate technologies. We leverage cutting-edge semiconductor processing technologies, including Chemical Mechanical Planarization, to produce high-performance substrates with 10x increase in interconnect density, paving the way for packages with up to a trillion transistors.

Job Responsibilities

Package Architecture, Co-Design & Optimization Perform signal integrity and power integrity analysis for high-speed interfaces, packages, substrates, and PCB interconnects.  Model and analyze high-speed channels including:  Signal Integrity (SI) analysis for high-speed digital interfaces and interconnects.  Power Integrity (PI) analysis, including Power Delivery Network (PDN) modelling and optimization of copper planes.  3D Electromagnetic (EM) simulation using ANSYS HFSS.  High-speed differential signaling. S-parameter extraction, signal path optimization, and EM coupling analysis. Develop simulation models to validate data integrity and system robustness. Package design & Integration Work closely with package design, layout, product engineering, and manufacturing teams to optimize design performance, using simulation optimization. Generate simulation reports, technical documentation, and design recommendations.  Package, substrate, and electrical performance characterization and validation.  Support failure analysis and root cause investigations related to electrical performance. Design simulation experiments (DoE) and communicate technical findings clearly to multidisciplinary teams and management via detailed reports and presentations. Technical Skills Strong experience in one or more of the following tools: ANSYS HFSS  ANSYS SI wave  ANSYS Mechanical (warpage) Cadence Allegro Package Designer version Release 25.1 Perform any other ad-hoc duties as assigned by the Manager, as required to support the team and organizational goals.

 

Job Requirements

Required Qualifications:

• Bachelors and 8+ years or Masters degree and 6+ years or PhD and 3+ years of related experience.
• BS/MS/PhD in Electrical Engineering (Preferred), Mechanical Engineering, Materials Science, or related field.
• Extensive hands-on experience in advanced IC packaging for advanced silicon nodes.
• Proven experience using simulation tools for complex engineering problems, ideally in Signal integrity.
• Strong understanding of high layer count, large body, flip chip BGA packaging technology.
• Proficiency in ANSYS HFSS, SI/PI, Signal integrity.
• Strong analytical, problem-solving, and communication skills. Ability to work both independently and as part of a team.
• Proven ability to drive NPI through HVM with strong cross-functional leadership.
• Excellent communication, documentation, and customer-facing skills.

Location & Commitments

• Premises located in 9 Pesawat Drive, Singapore 619607
• Permanent, full-time role working 40 hours per week

 

Contact us to apply

If you believe you possess the qualifications for this position, please submit your resume and cover letter to our HR team at hr_career@ast-sg.com.

 

Why Join Us

• Work on cutting-edge projects in a growing field.
• Collaborative and innovative environment.
• Competitive compensation and benefits.
• Opportunities for professional development.

 

Closing Statement

AST is dedicated to creating a workplace that is diverse, equitable, and inclusive, where every employee feels appreciated, respected, and empowered to share their unique perspectives.

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